X-RAY INSPECTION
X-ray inspection can be a very effective and non-destructive type of analysis. This form of interactive radiography provides internal viewing of an assembly’s design, internal components, workmanship and potential latent quality issues. Digital X-ray technology has added a new dimension to X-ray inspection that extends beyond traditional film-based cabinet type technology, including the use of specially devised algorithms for void analysis.
The term “digital” in digital X-ray refers to the technology of image acquisition where the data is collected or transferred to electronically stored media. Digital radiography detector technologies such as image intensifiers and solid-state panels can vary in size and pixel count. Digital radiography-based systems can offer the ability to view a sample while manipulating magnification, X-Y directions, rotation, tilt, and exposure. The advantage of digital X-ray over traditional film X-ray inspection is the improved imaging at magnification and the ease of image optimization.
Actively inspecting a device under manipulation is known as “real-time radiography”. Real-time X-ray systems can be equipped to mechanically rotate a device in steps, through a defined angular sequence, while collecting individual exposures. The exposures are assembled into a 3-dimensional model, where thin slices of the device can be generated and viewed, or stitched into 3D renderings, referred to as Computed Tomography or CT-Scans.
Standards & Specifications
- MIL-STD-1580
- MIL-STD-883, TM 2012*
- MIL-STD-750, TM 2076*
- MIL-STD-202, TM 209*
- MIL-STD-981, APPENDIX B
- MIL-DTL-3933
- MSFC-STD-355
- ESCC 20900
- IDEA-STD-1010
- MIL-PRF-27, APPENDIX B
- ASTM E1161
- ASTM E431
*ORS USA maintains DLA suitability for these test methods
Capabilities
- Submicron spot size
- 130 KV Range
- Image analysis and measurement software
- Oblique angle viewing 0 to 45 degrees
- Digital imaging
- Maximum inspection area of 18” x 16” (458mm x 407mm)
ORS will also work with clients to develop a specific Statement of Work (SOW) curated to the client’s analytical needs and ORS’ capabilities
Printed Circuit Board
- Solder Joint Formation
- Metallization Defects & Registrations
- Via Alignment
Ceramic Packages
- Frit Seals
- Foreign Material
- Die Attach
Metal Packages
- Lid Seals
- Die Attach
Plastic Packages
- Die Placement
- Die attach voiding
- Bond Wire Sweep
Ball Grid Arrays
- Solder Sphere Formation & Voiding
- Die Attach
Failure Analysis
High voltage silicon carbide diode with severe EOS damage
Folds in the plated thru-hole barrel
Crack in capacitor
Non-functioning key FOB
Void Analysis
Contact area voiding in QFN
BGA void analysis
Lid seal voiding in microcircuit
Bellows solder joint void analysis
Electronic Part Types
Other part types:
- DC-DC Converter
- Diodes (Thin key, Schottky, Wire-bonded, Zener voltage regulator)
- EMI Filter
- Isolator
- Quartz Crystal
- Bellows assemblies and sub-assemblies
- Optocoupler
- Filtered Connector
- Power Divider
- Resistor Network
- Fuse
- Switch
- PCBs